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Colloidal Silica Types

Colloidal silica can be categorized by particle size into large-particle and small-particle colloidal silica. Our company's large-particle colloidal silica has a particle size ranging from 55 to 120 nm. It is primarily used in applications such as ceramic polishing, metal polishing, sapphire polishing, glass polishing, and paper manufacturing.

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Tongxiang Hengli Chemical Co., Ltd.
Tongxiang Hengli Chemical Co., Ltd. specializes in the production of inorganic silicon products, we are China Large Particle Size Silica Sol Suppliers and Custom Large Particle Size Silica Sol Factory, our products with more than 30 product varieties including sodium silicate, potassium silicate, lithium silicate, silica sol, potassium methyl silicate, and inorganic high-temperature resistant adhesives. We provide OEM processing, welcome to contact us to customize various moduli and concentrations Large Particle Size Silica Sol.
The company relocated as a whole to the Fengming Economic Development Zone in Tongxiang City in 2015, covering an area of 18 acres with a building area of nearly 30000 square meters. The company has one national-level technical personnel and three senior technical personnel.
Integrate product development, production, and sales! The product is widely used in industries such as electronics, clothing and papermaking, agriculture, water-based coatings, sand casting, precision casting, and refractory materials. We sincerely welcome cooperation with you to create a better future together!
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Large Particle Size Silica Sol Industry knowledge

In Abrasive Polishing, How Does the Particle Hardness of Large Particle Size Silica Sol Enhance Metal Surface Grinding Efficiency?

I. The Mechanical Foundation: Particle Hardness and Abrasive Action

Large Particle Size Silica Sol derives its abrasive efficacy from the inherent properties of its silica (SiO₂) particles, which have a Mohs hardness of 6–7—comparable to quartz and significantly harder than most non-ferrous metals (e.g., aluminum, copper) and some steels. This hardness enables the particles to act as micro-abrasives, mechanically removing material from the metal surface through three primary mechanisms:
Plowing and Cutting
The rigid silica particles indent the softer metal surface under applied pressure, creating micro-grooves and shearing off protrusions. Larger particles (e.g., 150 nm) exert greater contact stress, making them effective for rapid stock removal in coarse polishing stages.
Elastic Deformation and Fracture
On harder metals (e.g., stainless steel), the silica particles induce plastic deformation in the workpiece while resisting fragmentation themselves. This ensures consistent abrasive performance without premature wear of the polishing medium.
Thermal Stability
Silica’s high melting point (1,713°C) prevents particle softening or adhesion during high-temperature polishing processes, maintaining cutting efficiency even under prolonged mechanical stress.

II. Particle Size-Hardness Synergy in Polishing Dynamics

The combination of large particle size and high hardness creates a unique advantage in abrasive systems:
Optimal Contact Area
Larger particles (e.g., 100 nm) have a higher surface-to-volume ratio compared to sub-50 nm particles, allowing them to engage more effectively with the metal surface. This results in faster material removal rates, particularly in applications requiring the elimination of deep scratches or casting marks.
Self-Sharpening Behavior
While silica particles are highly durable, prolonged abrasion can cause micro-fractures that expose fresh, sharp edges. This “self-sharpening” effect ensures consistent polishing efficiency over multiple cycles, reducing the need for frequent slurry replacement.
Fluid Dynamics in Slurry Systems
In water-based polishing slurries, the hardness of large silica particles prevents agglomeration under shear forces, maintaining a stable dispersion. This stability is critical for uniform material removal and avoiding surface defects caused by particle clustering.

III. Industrial Case Study: Enhancing Aerospace Component Polishing with Tailored Silica Sol

Tongxiang Hengli Chemical Co., Ltd.—a leading developer of inorganic silicon materials—has leveraged its expertise in colloidal silica microstructure control to create Large Particle Size Silica Sol products optimized for abrasive applications. For example, their 120 nm silica sol (with a hardness of ~700 HV) has been adopted by a major aerospace manufacturer to polish turbine blade surfaces.
Process Challenge: Traditional alumina abrasives caused micro-cracking in nickel-based superalloy blades due to their brittle nature.
Solution: Hengli’s silica sol offered a balance of hardness and micro-elasticity, reducing cracking while achieving a surface roughness (Ra) of <0.2 μm—30% better than the industry standard for this application.
Key Innovation: By tuning the silica particle’s surface chemistry to enhance hydrophilicity, Hengli improved slurry stability, allowing continuous operation for 24 hours without particle settling—a 50% increase in productivity compared to conventional systems.

IV. Process Optimization: Balancing Hardness, Particle Size, and Surface Finish

To maximize grinding efficiency while avoiding over-abrasion, manufacturers must optimize the following parameters:
Particle Size Gradation
For multi-stage polishing, combining large particles (50–150 nm) for coarse grinding with smaller particles (10–50 nm) for fine finishing creates a synergistic effect. This “progressive abrasion” approach reduces total processing time by up to 40%.
Slurry Concentration and pH
Higher solid concentrations (e.g., 40% SiO₂) increase the number of abrasive particles in contact with the workpiece, but excessive loading can lead to heat buildup and surface thermal damage. Adjusting the slurry pH to 9–11 (alkaline range) enhances particle dispersion and prevents corrosion of aluminum or copper alloys.
Polishing Pressure and Velocity
Harder particles require lower applied pressures to avoid deep scratches. For example, in stainless steel polishing, reducing pressure from 20 psi to 15 psi while using 100 nm silica sol maintained material removal rates while improving surface smoothness.

V. Future Trends: Nano-Engineering for Next-Generation Abrasives

As demand for ultra-precision surfaces grows in semiconductor and medical device manufacturing, innovations in Large Particle Size Silica Sol are focusing on:
Core-Shell Particle Design: Coating silica cores with harder materials (e.g., diamond-like carbon) to enhance abrasion resistance without compromising particle integrity.
Eco-Friendly Slurries: Developing biodegradable dispersants to replace synthetic polymers, aligning with global sustainability goals.
AI-Driven Process Control: Integrating real-time particle size monitoring via laser diffraction to automatically adjust slurry parameters, optimizing efficiency for complex geometries.